Model:AS-261-0-02
Type:Automated Semiconductor Assembly System
Reflow Speed:Up to 1000 components per minute
Bonding Capacity:Supports fine-pitch BGA and CSP packages
Power Supply:230V, 50/60Hz
Maximum Process Temperature:450°C
Cooling System:Water-cooled for precision temperature control
Automation Level:Fully automated with operator interface
Dimensions:960mm x 1200mm x 1400mm
Weight:Approximately 1200kg
Introducing the K&S AS-261-0-02, the premier choice for high-volume, high-precision semiconductor assembly in demanding environments. This system boasts a streamlined design that maximizes throughput while ensuring unparalleled accuracy in every assembly operation.
Equipped with advanced algorithms and state-of-the-art hardware, the AS-261-0-02 seamlessly integrates into your manufacturing line, offering unmatched efficiency and reliability. It is specifically engineered to handle complex components, including fine-pitch BGAs and CSPs, with ease.
Our system utilizes a water-cooled cooling system to maintain precise temperature control throughout the assembly process, crucial for achieving optimal performance and longevity of the assembled devices. This ensures consistent quality and reduces the risk of thermal damage.
The user-friendly operator interface simplifies the operational experience, allowing for quick setup and easy monitoring of the assembly process. Comprehensive diagnostics and reporting features provide real-time insights into system performance, facilitating proactive maintenance and optimization.
Designed with sustainability in mind, the AS-261-0-02 incorporates energy-efficient components and modular construction for easy upgrades and maintenance. This not only reduces environmental impact but also ensures long-term cost-effectiveness for your investment.
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